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Method for improving the thermal interface between the die and thermal solution by using a bimetallic strip heat-sink base

IP.com Disclosure Number: IPCOM000007586D
Publication Date: 2002-Apr-08

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for improving the thermal interface between the die and thermal solution by using a bimetallic strip heat-sink base. Benefits include improved package reliability, reduced load variability, and improved thermal-interface effectiveness.