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Method for solder ball stand-off management to enable ball-side package decoupling on BGA packages

IP.com Disclosure Number: IPCOM000007589D
Publication Date: 2002-Apr-08

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for solder ball stand-off management to enable ball-side package decoupling on BGA packages. Benefits include improved thermal performance and reduced manufacturing processing.