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Disclosed is a method for solder ball stand-off management to enable ball-side package decoupling on BGA packages. Benefits include improved thermal performance and reduced manufacturing processing.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
77% of the total text.
for solder ball stand-off management to enable ball-side package decoupling on
Disclosed is a method for solder ball stand-off management to
enable ball-side package decoupling on BGA packages. Benefits include improved
thermal performance and reduced manufacturing processing.
a hole is routed in a motherboard to enable BGA-package land-side caps to
protrude through the board.
disclosed method includes a choice of solder ball and capacitor materials to
enable land-side processing on surface-mount BGA packages (see Figure 1). The
key elements of the method are:
High stand-off BGA solder balls
Low-profile package capacitors
disclosed method provides advantages over the conventional solution, including:
An elegant approach to cost-effective power delivery to
the package (lower layer count package)
No additional cost/manufacturing overhead for OEMs
Synergy between socketed and surface mounted processors
disclosed method utilizes 30-mil diameter 10/90 Sn/Pb, Sn/Ag or Sn/Ag/Cu solder
balls. This design provides reliable joints on a 50-mil ball grid package. The
reflow profiles must be configured so the solder ball is not reflowed. The
joint is formed by the solder paste. This design provides a stand off of at
least 0.75 mm on the landside. This dimension enables the placement of
low-profile caps that are 0.55 mm in height on the BGA side of the package.