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Method for an integrated on chip thermoelectric cooling module

IP.com Disclosure Number: IPCOM000007591D
Publication Date: 2002-Apr-08
Document File: 6 page(s) / 221K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated on-chip thermoelectric cooling (TEC) module. Benefits include improved functionality, improved thermal performance, and simplified manufacturing process.