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Method for an ESD grounding clip for next-generation form factor modules

IP.com Disclosure Number: IPCOM000007594D
Publication Date: 2002-Apr-08
Document File: 3 page(s) / 337K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an ESD grounding clip for next-generation form factor modules. Benefits include improved functionality and improved maintainability.