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Method for a thermocouple attachment to a metallic surface using solder

IP.com Disclosure Number: IPCOM000007596D
Publication Date: 2002-Apr-08
Document File: 5 page(s) / 84K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thermocouple attachment to a metallic surface using solder. Benefits include improved thermal performance.