Browse Prior Art Database

A LOW COST, ADHESIVE-LESS, HEATSPREADER EQUIPPED PLASTIC PACKAGE

IP.com Disclosure Number: IPCOM000007601D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-09
Document File: 2 page(s) / 80K

Publishing Venue

Motorola

Related People

Authors:
Frank Djennas Bennett Joiner Les Posthlewaith

Abstract

The plastic Quad Flat Package has evolved into a large, high pin count package, however higher costs and thermal dissipation requirements constitute the boundary conditions it must overcome to evolve as a viable high density package. The present mold com- pounds used as encapsulants have poor thermal con- ductivity and represent a large portion of the ther- mal resistance in the plastic package. Existing thermally enhanced plastic packages are prone to delamination, and command steep prices.