Browse Prior Art Database

BUILDING AND TESTING A HI-SPEED MODULE/IC PACKAGE

IP.com Disclosure Number: IPCOM000007607D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-09

Publishing Venue

Motorola

Related People

Authors:
Bob Scofield

Abstract

The electrical test ofmultiple semiconductor die modules or packages have to address the problem of having the inputs and outputs of complex semicon- ductor die unavailable for the application oftest stim- ulus and measurement. The test and evaluation of the product generally requires the generation of a long and arduous set of test vectors for system level test, In most cases, total fault coverage with respect to the operating frequency range and application spec- trum of the product must be sacrificed such that only fault coverage for an application-specific set of operating conditions can be guaranteed.