MODULAR POWER SUBSTRATE DESIGN CONCEPT FOR MULTIPLE HIGH POWER MODULE APPLICATIONS
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-09
In summary, this idea covers the design and method of making a high-power module. A high- power module structure is proposed composed of the following: silicon or gallium arsenide chips, alu- minum or gold wirebonds, a metallized ceramic sub- strate, metal buss-bars, and a heatsink. All compo- nents are encased in plastic, filled with a silicon gel and an epoxy for protection.