Browse Prior Art Database

MODULAR POWER SUBSTRATE DESIGN CONCEPT FOR MULTIPLE HIGH POWER MODULE APPLICATIONS

IP.com Disclosure Number: IPCOM000007610D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-09

Publishing Venue

Motorola

Related People

Authors:
Joe Martinez Ken Berringer Carl Raleigh

Abstract

In summary, this idea covers the design and method of making a high-power module. A high- power module structure is proposed composed of the following: silicon or gallium arsenide chips, alu- minum or gold wirebonds, a metallized ceramic sub- strate, metal buss-bars, and a heatsink. All compo- nents are encased in plastic, filled with a silicon gel and an epoxy for protection.