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Thermal Management For Flip-Chip (C4) Backside Mechanical Contact Probing

IP.com Disclosure Number: IPCOM000007629D
Publication Date: 2002-Apr-10
Document File: 17 page(s) / 26M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of thermal management for flip-chip (C4) backside mechanical contact probing. Benefits include a way of controlling the temperature of all high-powered CPUs and chipsets for debug and design validation. This method also provides various temperatures to be selected to provide characterization data at both hot and cold temperatures.