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Browse Prior Art Database

SPACE EFFICIENT POWER DIE ASSEMBLY

IP.com Disclosure Number: IPCOM000007657D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-11

Publishing Venue

Motorola

Related People

Authors:
Graham Adams

Abstract

The use of power devices causes a number of major design issues when trying to integrate them into the main layout. The need to often attach such power devices to heatsinks results in power devices being put round the outside of the substrate. This is often wasteful on space, and seldom is the best posi- tion electrically. In addition, the connection of power devices to the substrate can be messy, with pack- aged devices normally requiring wave soldering, and bare die requiring wire bonding on the main line.