DISPOSABLE/INTERCHANGEABLE VACUUM TABLE SURFACE FOR THE APPLICATION AND REMOVAL OF ADHESIVE MATERIALS
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-15
Most wafer thinning operations protect the front side (circuit side) of their wafers with a protective laminate. The laminate is placed on the front side of the wafer to protect the circuitry while the wafer is mechanically thinned. Once the wafer has been thinned, the laminate must be removed.