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DISPOSABLE/INTERCHANGEABLE VACUUM TABLE SURFACE FOR THE APPLICATION AND REMOVAL OF ADHESIVE MATERIALS

IP.com Disclosure Number: IPCOM000007681D
Original Publication Date: 1996-May-01
Included in the Prior Art Database: 2002-Apr-15
Document File: 2 page(s) / 96K

Publishing Venue

Motorola

Related People

Authors:
Robert Clark Anthony Weeks Rex Ickes

Abstract

Most wafer thinning operations protect the front side (circuit side) of their wafers with a protective laminate. The laminate is placed on the front side of the wafer to protect the circuitry while the wafer is mechanically thinned. Once the wafer has been thinned, the laminate must be removed.