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Method for producing ultra-thin wafers using bombardment with highly accelerated nanometer-scale particles

IP.com Disclosure Number: IPCOM000007687D
Publication Date: 2002-Apr-15

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an innovative technique to produce ultra-thin wafers using bombardment with highly accelerated nanometer-scale particles. Benefits include improved ease of manufacturing and improved reliability.