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Disclosed is a method for a semiconductor package with an integrated self-alignment and retention feature. Benefits include improved reliability and simplified manufacturing process.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
68% of the total text.
Method for a semiconductor package with an integrated
self-alignment and retention feature
Disclosed is a method for a semiconductor package with an
integrated self-alignment and retention feature. Benefits include improved
reliability and simplified manufacturing process.
over-molded semiconductor package can be surface mounted onto a flexible tape
interconnect (see Figure 1). The tape folds to form the package. Recessions (or
dimples) are molded into the mold cap as reservoirs to reduce the thickness of
the adhesive used to hold the folded component together (see Figure 2).
conventional solution includes the use of robotic assembly equipment and the
application of external adhesives.
disclosed method aligns the folded package components (see Figure 3). The use
of precision press fits, snap, or interlocking features provides retention
between the two package segments (see Figure 4). These alignment and retention
features can also be applied to the test socket and other equipment (see Figure
5). A positive locking feature securely snaps the package segments into place
(see Figure 6).
alignment features support lower cost manufacturing through higher speed and
less precision during the package folding operation while controlling package
dimensions and placement. The requirement for adhesives to hold package
segments together is eliminated or reduced. Because the device is held
together, the adhesive cure step can occur away from the folding...