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Disclosed is a method for using a highly thermal-conductive keypad and metallic front panel to dissipate heat from a cellular phone. Benefits include improved thermal performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
50% of the total text.
Method for using a highly
thermal-conductive keypad and metallic front panel to dissipate heat from a
Disclosed is a method for using a
highly thermal-conductive keypad and metallic front panel to dissipate heat
from a cellular phone. Benefits include improved thermal performance.
power dissipation of the logic component inside the cellular phone keeps
increasing. The conventional cooling solution is the natural convection within
the limited space inside the phone and is no longer sufficient.
conventional design includes a plastic front panel and a silicone rubber keypad
for the current cellular phone design (see Figure 1). The plastic and silicone
rubber are both low-thermal conductive materials that form a thermal barrier
between the internal components and the external ambient.
The logic component is typically mounted
on the bottom side of a PCB (see Figure 2). The topside is the keypad circuit.
Although the PCB can help spread the heat from the logic component, the heat is
difficult to dissipate to the external ambient because the plastic front panel
and the silicone rubber keypad form thermal barriers due to their low thermal
disclosed method is cellular phone case design. A highly thermal-conductive keypad is made of
silicone rubber with zinc oxide, aluminum oxide, and boron nitride particles.
The keypad enhances heat transfer from the internal components inside the
cellular phone to the external ambient environment. A metallic front panel with
metal posts forms additional thermal conduction paths from PCB t...