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Method for using a highly thermal-conductive keypad and metallic front panel to dissipate heat from a cellular phone

IP.com Disclosure Number: IPCOM000007716D
Publication Date: 2002-Apr-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using a highly thermal-conductive keypad and metallic front panel to dissipate heat from a cellular phone. Benefits include improved thermal performance.