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Disclosed is a method for a mirrored stacked-die package. Benefits include improved functionality and improved performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
100% of the total text.
Method for a mirrored stacked-die package
Disclosed is a method for a mirrored stacked-die package.
Benefits include improved functionality and improved performance.
disclosed method is a grooved substrate (see Figure 1). Each die is stacked one
after the other. The top three die are like the mirror image of the bottom
three die. Total package height could approximate 1.4 mm for a 6-die stack-up.
The increase in total memory capacity of the package is achieved with minimal
increase in package height. The assembly process and material set are similar
for any number of dies included in a package.
disclosed method provides advantages, including:
An option in package thickness reduction
Flexibility of stacking additional die without the
additional cost incurred with the development/implementation of an assembly