A NOVEL METHOD OF MINIMIZING PRINTED WIRE BOARD WARPAGE
Original Publication Date: 1996-Aug-01
Included in the Prior Art Database: 2002-Apr-22
A method was developed to counter board warpage created by attaching die, die packages, encapsulants, and other SMT attachments to the printed wire board. The method involves applying a thin plastic coating to the underside ofthe device or attachment. The applied material will expand and contract during thermal cycling to counter the warpage generated by attachments to the printed wire boards. The method was shown to signiEcantly increase ther- mal shock reliability ofthe attached devices.