FINAL TEST DEVICE TEMPERATURE CONTROL SYSTEM
Original Publication Date: 1996-Aug-01
Included in the Prior Art Database: 2002-Apr-22
Heat is generated during the operation of devices undergoing final test. Any increase in device junc- tion temperature during test increases the difference in temperature between the device and the test envi- ronmental chamber. In addition, temperature varia- tion exists between sites due to equipment and testing conditions. Maintaining a small temperature differ- ential between the device and the environmental chamber and also a uniform temperature differen- tial between sites during test is critical to testing Motorola devices at specified temperatures.