A COMPREHENSIVE MODULE DISABLE FUNCTION FOR MULTI-MODULE EMBEDDED SYSTEMS
Original Publication Date: 1996-Aug-01
Included in the Prior Art Database: 2002-Apr-22
There are times when "Time-to-Market" is more important than the cost of silicon. One example is when entering a new market where there is already competition. Bringing a new device into a market significantly later than other devices results fin loss of market share. Another example is when a spe- cific customer requests a delivery date that is earlier than the current design and fabrication cycle time. For these cases the question is, "are there methods that can be used to capitalize on existing silicon to provide saleable product earlier?' There are other situations when "Yield" is the problem. Many parts are being made, but the yield ofgood saleable devices is low due tdlocalized man- ufacturing defects or design errors. In this case the question asked is, "ifthe defects or design errors are localized to within a module, can that module be isolated and effectively removed so that the die can be reclaimed as a part that does not include that module?' There are techniques that can be applied which will allow both the re-use of existing silicon to rep- resent a new device with less functionality, and to be able to reclaim bad die that has localized defects or design errors contained within a module or modules.