OVERPRINTING PASTE FOR SELF-ALIGNING
Original Publication Date: 1996-Aug-01
Included in the Prior Art Database: 2002-Apr-24
The electronics industry is recognizing the requirements for better utilization of the area of printed circuit boards. One means to accomplish this would be to use Integrated Circuit packages which include interconnects which reside underneath the carrier in an array format. One of the more pop- ular formats is the ball grid array (BGA), which is where solder spheres of known volumes are pre- applied to the underside ofthe carrier in a grid pattern.