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Method for an optimized 10-GHz differential signaling package layout for a typical 4-layer PBGA package with FR-4 board stackup

IP.com Disclosure Number: IPCOM000007826D
Publication Date: 2002-Apr-25

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an optimized 10-GHz differential signaling package layout for a typical 4-layer plastic ball grid array (PBGA) package with FR-4 board stackup. Benefits include improved performance and improved reliability.