SOLDER BUMPS AND ELECTROPLATED INDUCTORS ON THE SAME DIE
Original Publication Date: 1996-Aug-01
Included in the Prior Art Database: 2002-Apr-29
To date we have been processing wafers with solder bumps for flip chip applications and have developed a process for manufacturing planar, spiral copper inductors for RF applications. The purpose of this disclosure is to describe the process for implementing these two structures on the same die, thus allowing for flip chip of die with the spiral induc- A) Process 1 1) sputter Ti-W and Cu 2) spin resist 3) Photolithography for the inductors and bump pedestals 4) Electroplate the Cu inductors and bump pedestals 5) Strip the resist 6) Etch the excess Cu bus metal 7) Spin resist 8) Photolithography to complete the solder bumps 9) Complete electroplating of the rest of the Cu portion ofthe bump 10) Electroplate the solder onto the Cu bump 11) Strip the resist 12) Etch the excess Ti-W bus metal 13) Reflow the solder tors. The potential applications would be in any RF application including pagers and cellular phones.