OXYGENATED Ml3ALLIZATION SYSTEM FOR SUPERIOR ADHESION TO POLYETHERIMIDE (PEI)/GLASS COMPOSITES
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-Apr-29
Metallization of three-dimensional (3D) molded polymer substrates by DC sputtering is an exciting alterna'tive to traditional electroless plating processes. This technology offers the ability to rapidly coat a three dimensional circuit base without the use of precious metal catalysts or plating baths that may be environmentally harmful. Thus, sputter coating offers high through-put and flexibility while mini- mizing disposable wastes.