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OXYGENATED Ml3ALLIZATION SYSTEM FOR SUPERIOR ADHESION TO POLYETHERIMIDE (PEI)/GLASS COMPOSITES

IP.com Disclosure Number: IPCOM000007850D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-Apr-29

Publishing Venue

Motorola

Related People

Authors:
Reggie Barnes John Halley Kevin Arledge Tom Swirbel

Abstract

Metallization of three-dimensional (3D) molded polymer substrates by DC sputtering is an exciting alterna'tive to traditional electroless plating processes. This technology offers the ability to rapidly coat a three dimensional circuit base without the use of precious metal catalysts or plating baths that may be environmentally harmful. Thus, sputter coating offers high through-put and flexibility while mini- mizing disposable wastes.