DIE FACE DECOUPLING CAPACITOR SYSTEMS
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-Apr-30
Positioning a source of decoupling capacitance very close to the input,and outputs of an integrated circuit (IC) is very desirable since it minimizes the parasitics, especially the inductance, of the intercon- nect linking the capacitance to the IC. The use of discrete multilayer ceramic capacitors is most com- mon, but it is ohen difficult to locate these devices as close to the IC as desired. It is becoming increas- ingly common to build capacitance into the interconnection substrate to which the IC is con- nected. Ohen this is not ideal since the level ofcapac- itance attained is inadequate or the parasitics ofthe interconnect from the IC to the capacitance is high enough to reduce the effectiveness of the capaci- tance for decoupling or local power supply.