OVERPRINTING PASTE FOR SELF-ALIGNING
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-01
The electronics industry is recognizing the requirements for better utilization of the area of printed circuit boards. One means to accomplish this would be to use Integrated Circuit packages which include interconnects which reside under- neath the carrier in an array format. One ofthe more popular formats is the ball grid array (BGA), which is where solder spheres of known volumes are preapplied to the underside of the carrier in a grid pattern.