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IP.com Disclosure Number: IPCOM000007887D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-02

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Brian Webb Jim Perkins


Semiconductor packages are being driven to be smaller lighter and thinner by our customers. One millimeter or less thick packages are common, resulting in requirements to fill the package thick- ness between the flag of the leadframe and the bot- tom of the package with defect free mold compound in order to insure environmental integrity, The thick- ness of this plastic may be from ,006 - ,008 inch thick. As the present thermoset molding compounds flow into the mold cavity they follow the path of least resistance, over the die to the vent, and finally filling the area under the flag. This ohen results in nit lines and voids under the flag, which are paths for moisture ingress. Thermally enhanced packages with heat spreaders are an even greater problem.