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Browse Prior Art Database

VIALESS MULTILAYER BALL GRID ARRAY IC PACKAGE

IP.com Disclosure Number: IPCOM000007890D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-02
Document File: 1 page(s) / 53K

Publishing Venue

Motorola

Related People

Authors:
Yutaka Doi

Abstract

A vialess package is disclosed to be used for a single IC (integrated circuit) whose electrical interconnection is distributed on multiple layers on the package. Offsetting of the layers allows attach- ment of solder balls for both BGA (ball grid array) package and DCA (direct chip attach) without using any vias.