VIALESS MULTILAYER BALL GRID ARRAY IC PACKAGE
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-02
A vialess package is disclosed to be used for a single IC (integrated circuit) whose electrical interconnection is distributed on multiple layers on the package. Offsetting of the layers allows attach- ment of solder balls for both BGA (ball grid array) package and DCA (direct chip attach) without using any vias.