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SEALED CONNECTOR ASSEMBLY FOR LOW-COST, HIGH THERMAL CONDUCTIVITY PACKAGE

IP.com Disclosure Number: IPCOM000007922D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-06

Publishing Venue

Motorola

Related People

Authors:
Peter Collier

Abstract

There are reported proposals to develop low tem- perature inorganic (glass/ceramic) coating on alu- minum substrates through so-gel or plasma processes and further to form conductor patterns on planar surfaces. The concepts allow for the use of alumi- num as a low-cost, thermally conductive substrate material, but do not address the formation of her- metic, electrical feed-throughs to allow exterior mounting ofa connector.