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WAVY OMEGA STRAP FOR MODULAR INTERCONNECT THERMAL EXPANSION CONSIDERATIONS

IP.com Disclosure Number: IPCOM000007932D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07

Publishing Venue

Motorola

Related People

Authors:
Ken Bieda Jerry McFarlin Roy Stone

Abstract

The omega straps currently used as interconnects between modules or between modules and circuit boards exist in two forms. The first is the basic shape from which the name is derived, stemming From the Greek letter omega. This strap has a single "hump" between two terminations or feet. The mate- rial is a solid piece of copper with a tin plating on the underside of the "hump" section. Each termi- nation has a single hole centered on each. It was discovered that thermal coefficient of expansion dif- ferences between adjoining modules and circuit boards created shearing forces to which the original omega strap did not acceptably perform. Either the strap would break, tear off the solder connection or rip the circuit loose from the circuit board. If viewed from above the solid omega worked well in the Y and Z directions but not X, Y and Z at the same time. Because of these considerations the second type of omega strap was invented.