APPARATUS FOR PROTECTING WAFER PLACEMENT VACUUM CHUCKS
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07
The SEZ Spin Etch process has the ability to leave stains, on the backside of a wafer, which are not visible until gold has been alloyed onto the stained surface (Figure 1). If a wafer breaks, fiat- tures, or is miss-processed, and the SEZ transfer arm touches a stained wafer or a contaminated etch chuck (Figure 2), the vacuum chuck of the transfer arm will be contaminated.