Browse Prior Art Database

APPARATUS FOR PROTECTING WAFER PLACEMENT VACUUM CHUCKS

IP.com Disclosure Number: IPCOM000007934D
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07

Publishing Venue

Motorola

Related People

Authors:
Anthony Robert Weeks

Abstract

The SEZ Spin Etch process has the ability to leave stains, on the backside of a wafer, which are not visible until gold has been alloyed onto the stained surface (Figure 1). If a wafer breaks, fiat- tures, or is miss-processed, and the SEZ transfer arm touches a stained wafer or a contaminated etch chuck (Figure 2), the vacuum chuck of the transfer arm will be contaminated.