CHAMELEON ASSEMBLY AND TEST CARRIER
Original Publication Date: 1996-Nov-01
Included in the Prior Art Database: 2002-May-07
The carrier described herein is suited to handle a leaded, optical, surface mounted package. Many assembly process steps are required before attaching the die and prior to final electrical/optical testing of this package. Because of these process steps, han- dling damage to the package is high. Defects such as scratches of the light guides, bent leads and delam- ination can occur.