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High-Resolution Measurement System for Package Thermal Resistance

IP.com Disclosure Number: IPCOM000007941D
Publication Date: 2002-May-07

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for cooling packages during high-resolution thermal resistance tests. Benefits include higher precision in measuring junction-to-case thermal resistance, the ability to dissipate more heat, and a shorter testing time.