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Browse Prior Art Database

Method for a through-hole preload retention apparatus for BGA packages

IP.com Disclosure Number: IPCOM000007942D
Publication Date: 2002-May-07
Document File: 5 page(s) / 949K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a through-hole preload retention apparatus for BGA packages. Benefits include improved solder joint and package reliability.