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Method for the use of larger corner solder balls with PCB alignment holes for the alignment of very fine pitch chip scale packages during placement

IP.com Disclosure Number: IPCOM000007944D
Publication Date: 2002-May-07
Document File: 5 page(s) / 190K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of larger corner solder balls with PCB alignment holes for the alignment of very fine pitch chip scale packages during placement. Benefits include reduction of defects and improved throughput.