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Method for a thin, spacerless quadruple stack chip scale package and an underfill material for overhang in molded matrix array packages with multiple dice

IP.com Disclosure Number: IPCOM000007945D
Publication Date: 2002-May-07

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thin, spacerless quadruple stack chip scale package (TSQS-CSP) and an underfill material for overhang in molded matrix array packages with multiple dice (MMAPx). Benefits include improved reliability and reduced defects.