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Method for a material to maintain a lead-free reflow temperature hierarchy for surface mounting pins, connectors, and other SMT components

IP.com Disclosure Number: IPCOM000007949D
Publication Date: 2002-May-07
Document File: 2 page(s) / 32K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a material to maintain a lead-free reflow temperature hierarchy for surface mounting pins, connectors and other surface-mount technology (SMT) components. Benefits include improved functionality and improved reliability.