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HYBRID POWER MODULE INTERCONNECTION METHOD FOR STRAIN RELIEF USING S BEND AND C BEND STAMPED LEADS

IP.com Disclosure Number: IPCOM000007957D
Original Publication Date: 1997-Mar-01
Included in the Prior Art Database: 2002-May-08
Document File: 4 page(s) / 188K

Publishing Venue

Motorola

Related People

Authors:
Martin Kalfus

Abstract

The assembly of intelligent power modules with vertically integrated control logic requires numer- ous interconnections between the power stage or substrate and the control stage. In addition to the control function, a different set of connections is needed to provide power in and out terminations. Similarly, in dumb modules, it is necessary to bring to the outside world all the connections necessary to operate the semiconductors within. This is usually done with several sets of terminals and in some cases many different shapes and sizes may be need- ed. The cost of stamping tooling for several lead sets and complex fixtures for alignment has moti- vated the development of the following concepts.