Browse Prior Art Database

POLYGON BALL GRID ARRAY CHIP SCALE PACKAGE (PCSP)

IP.com Disclosure Number: IPCOM000007968D
Original Publication Date: 1997-Mar-01
Included in the Prior Art Database: 2002-May-09

Publishing Venue

Motorola

Related People

Authors:
Paul Lin Mike McShane

Abstract

Hexagonal shaped semiconductor die are known to increase wafer packing density (See, e.g., U.S. Patent #5,075,253). Conventional IC packages are square or rectangular with leads on the periph- ery. Using such conventional packages with hexag- onally shaped die defeats the packing density achieved by changing the shape of the die.