POLYGON BALL GRID ARRAY CHIP SCALE PACKAGE (PCSP)
Original Publication Date: 1997-Mar-01
Included in the Prior Art Database: 2002-May-09
Hexagonal shaped semiconductor die are known to increase wafer packing density (See, e.g., U.S. Patent #5,075,253). Conventional IC packages are square or rectangular with leads on the periph- ery. Using such conventional packages with hexag- onally shaped die defeats the packing density achieved by changing the shape of the die.