HIGH PERFORMANCE CERAMIC QUAD FLAT PACKAGE (HPCQFP) WITH MULTILAYER BASE AND SURFACE PAD CONTACTS
Original Publication Date: 1997-Mar-01
Included in the Prior Art Database: 2002-May-09
Integrated circuit package designers are faced with the need to increase performance, such as higher number of I/OS, electrical and thermal, while reducing size and cost. Many of the advanced, high performance microprocessors arc sensitive to ground bounce and heat dissipation that are, in part, controlled by IC package design.