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Browse Prior Art Database

HIGH PERFORMANCE CERAMIC QUAD FLAT PACKAGE (HPCQFP) WITH MULTILAYER BASE AND SURFACE PAD CONTACTS

IP.com Disclosure Number: IPCOM000007972D
Original Publication Date: 1997-Mar-01
Included in the Prior Art Database: 2002-May-09

Publishing Venue

Motorola

Related People

Authors:
Paul Lin Mike McShane

Abstract

Integrated circuit package designers are faced with the need to increase performance, such as higher number of I/OS, electrical and thermal, while reducing size and cost. Many of the advanced, high performance microprocessors arc sensitive to ground bounce and heat dissipation that are, in part, controlled by IC package design.