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Method for fine-pitch substrate pre-soldering using an in-place photo-definable resist material

IP.com Disclosure Number: IPCOM000008059D
Publication Date: 2002-May-15
Document File: 3 page(s) / 60K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for fine-pitch substrate pre-soldering using an in-place photo-definable resist material. Benefits include process simplification and improved functionality.