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Browse Prior Art Database

Method for a self-crack-mending polymer for underfill technology in IC packaging

IP.com Disclosure Number: IPCOM000008061D
Publication Date: 2002-May-15
Document File: 3 page(s) / 151K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a self-crack-mending polymer for underfill technology in integrated circuit (IC) packaging. Benefits include improved reliability.