Dismiss
InnovationQ will be updated on Sunday, September 22, from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for a silica-filled solder paste for BGA bumping

IP.com Disclosure Number: IPCOM000008062D
Publication Date: 2002-May-15
Document File: 4 page(s) / 438K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a silica-filled solder paste for ball grid array (BGA) bumping. Benefits include improved reliability.