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Method for the direct solder attachment of two or more printed circuit boards without a connector using top-side soldering

IP.com Disclosure Number: IPCOM000008067D
Publication Date: 2002-May-15
Document File: 2 page(s) / 57K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the direct solder attachment of two or more printed circuit boards without a connector using top-side soldering. Benefits include improved reliability, improved speed, and improved impedance.