Dismiss
InnovationQ will be updated on Sunday, September 22, from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Structures and Methods to Attach Ultra Thin Die to Printed Wiring Boards: 1)Using a Transparent Wafer and Heat Release Adhesive and 2) Using a Transparent Wafer and Photodegradable Adhesive

IP.com Disclosure Number: IPCOM000008107D
Original Publication Date: 2002-May-17
Included in the Prior Art Database: 2002-May-17
Document File: 3 page(s) / 57K

Publishing Venue

Motorola

Related People

Inventors:
Krishna Kalyanasundaram Daniel Gamota Andrew Skipor

Abstract

Lower semiconductor package thickness and less weight are among the significant benefits of using ultra-thin die. The methodology used today to assemble circuits with ultra-thin die is time and labor-intensive as well as costly. A high-volume-compatible IC structure for a microelectronic device enabling the attachment of thin die to substrates is proposed that addresses the aforementioned issues.