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VIBRATION SOLDER PROCESS FOR OMPAC IC

IP.com Disclosure Number: IPCOM000008114D
Original Publication Date: 1997-Jun-01
Included in the Prior Art Database: 2002-May-20

Publishing Venue

Motorola

Related People

Authors:
Stefan Lichterfeld

Abstract

The problem that is discussed here is based on the soldering process of OMPAC Integrated Circuits (I&). The improvements provided by this paper include a more physical and chemical solder connection between the XC, its pads and the Printed Circuit Board (PCB) pads, an improved ageing per- formance and more reliable solder contacts under mechanical stress.