Browse Prior Art Database

INTEGRATED EMC VENT AND HEATSINK

IP.com Disclosure Number: IPCOM000008185D
Original Publication Date: 1997-Jun-01
Included in the Prior Art Database: 2002-May-24

Publishing Venue

Motorola

Related People

Authors:
Thomas Paul Groves Malcolm John Perry

Abstract

The principle uses the natural height, length and breadth of natural or forced air convection cooling fms used in the cooling of electronic assemblies to form a matrix of waveguides operating beyond their cut off frequency. This may then be used to provide attenuation to tf. fields when the heatsink assembly forms a vent in an electrically screened enclosure. Figure 1 illustrates a typical example of an enclo- sure utilizing such a device.