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INCREASING THE USEABLE TRACKING AREA ON FLEXIBLE SUBSTRATE DESIGNS

IP.com Disclosure Number: IPCOM000008192D
Original Publication Date: 1997-Jun-01
Included in the Prior Art Database: 2002-May-24

Publishing Venue

Motorola

Related People

Authors:
David Willis

Abstract

When using a "flexible" substrate with separately rigidised regions which are"folded up" after compo- nent placement and soldering, the bottleneck for copper track routing can often be between adjacent folded-up sections. This is especially true where a connector is soldered to one of the folded rigidised sections, and input or output circuits are placed onto the adjacent folded up section. Routing the tracks via the main rigidised section will effectively reduce the available substrate area (for component placement and tracking). A typical substrate outline is shown in Figure 1, with the rigidised sections cross-hatched. When folded-up, this would look like Figure 2.