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Method for embedding passive components in the PTHs of an IC package

IP.com Disclosure Number: IPCOM000008236D
Publication Date: 2002-May-29
Document File: 4 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for embedding passive components in the plated throughholes (PTHs) of an integrated circuit (IC) package. Benefits include improved signal quality and improved performance.