Browse Prior Art Database

Method for a low-cost stamped integrated heat spreader design with solder for attachment to the substrate

IP.com Disclosure Number: IPCOM000008241D
Publication Date: 2002-May-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-cost stamped integrated heat spreader (IHS) design with solder for attachment to the substrate. Benefits include improved thermal performance, improved reliability, and reduced defects.