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Method for Increasing I/O Count on a Silicon Component Utilizing Star-Shaped Land Pad Arrangements

IP.com Disclosure Number: IPCOM000008243D
Publication Date: 2002-May-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for increasing the number of signal I/Os on a component package, while still using a four-layer motherboard. Benefits include substantial cost savings by maintaining a smaller package size.