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Browse Prior Art Database

HIGH-DENSITY POWER PACKAGE FOR USE IN MOTOR CONTROL INVERTERS

IP.com Disclosure Number: IPCOM000008265D
Original Publication Date: 1997-Sep-01
Included in the Prior Art Database: 2002-May-31
Document File: 4 page(s) / 189K

Publishing Venue

Motorola

Related People

Authors:
Joe L. Martinez, Jr. James Fusaro

Abstract

The need exists in electronic packaging for high-power densities. The increased demand for more efftcient heat removal is driving the need for liquid cooled concepts. A packaging concept incorporating liquid cooling is presented here for use in power modules which have operating currents greater than 100 amps at voltage ratings above 6OOV.