HIGH-DENSITY POWER PACKAGE FOR USE IN MOTOR CONTROL INVERTERS
Original Publication Date: 1997-Sep-01
Included in the Prior Art Database: 2002-May-31
The need exists in electronic packaging for high-power densities. The increased demand for more efftcient heat removal is driving the need for liquid cooled concepts. A packaging concept incorporating liquid cooling is presented here for use in power modules which have operating currents greater than 100 amps at voltage ratings above 6OOV.